An investigation has been made into the behaviour of high-purity silicon (HP-Si) during the fabrication of microstrip detectors. The resistivity of the silicon used is 3 k-OMEGA cm. The investigation is centred on standard bipolar processes based on ion implantation. It is found that, comparing the processes used, the best diode characteristics are achieved when a heat treatment at 600-degrees-C is used after the ion-implantation step, whereas the worst results from an implantation and a 900-degrees-C heat treatment. Thus it is shown that if integration of the electronic circuitry and the detector on a single chip is required, then the high-temperature heat treatments must be done before the ion-implantation step needed for detector fabrication.
Processing high-quality silicon for microstrip detectors / Nava, Filippo; Ottaviani, Giampiero; Tonini, Rita; Frabboni, Stefano; A., Alberigi Quaranta; P., Cantoni; P. L., Frabetti; L., Stagni; G., Queirolo; P. F., Manfredi. - In: SENSORS AND ACTUATORS. A, PHYSICAL. - ISSN 0924-4247. - STAMPA. - 32:(1992), pp. 366-371. [10.1016/0924-4247(92)80014-T]