In this paper, a multiscale modeling platform for neuromorphic computing devices connecting the atomic material properties to the electrical device performances is presented. The main ingredients of the modeling platform are discussed in view of the different technologies (e.g. RRAM, PCM, FTJ) proposed for 3D integrated neuromorphic computing.
Multiscale modeling of neuromorphic computing: From materials to device operations / Larcher, L., Padovani, A., Di Lecce, V.. - (2018), pp. 11.7.1-11.7.4. (63rd IEEE International Electron Devices Meeting, IEDM 2017 usa 2017) [10.1109/IEDM.2017.8268374].
Multiscale modeling of neuromorphic computing: From materials to device operations
Larcher L.;Padovani A.;Di Lecce V.
2018
Abstract
In this paper, a multiscale modeling platform for neuromorphic computing devices connecting the atomic material properties to the electrical device performances is presented. The main ingredients of the modeling platform are discussed in view of the different technologies (e.g. RRAM, PCM, FTJ) proposed for 3D integrated neuromorphic computing.
Pubblicazioni consigliate
I metadati presenti in IRIS UNIMORE sono rilasciati con licenza Creative Commons CC0 1.0 Universal, mentre i file delle pubblicazioni sono rilasciati con licenza Attribuzione 4.0 Internazionale (CC BY 4.0), salvo diversa indicazione.
In caso di violazione di copyright, contattare Supporto Iris
