Pd/Ag based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of microsctructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300 C to 850 C. The samples were investigated by means of X-ray diffraction, SEM amd EDAX analysis techiques; the results of these analises as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of the resistivity and adhesion. The relevance and limitations of each analytical technique for the examination of thick-film conductors are emphasized.
Evolution of microstructure and performance of Pd/Ag-based thick-film conductors / M., Prudenziati; Morten, Bruno; M. F., Brigatti. - In: ACTIVE AND PASSIVE ELECTRONIC COMPONENTS. - ISSN 0882-7516. - ELETTRONICO. - 12:(1985), pp. 41-57.
Evolution of microstructure and performance of Pd/Ag-based thick-film conductors
MORTEN, Bruno;
1985
Abstract
Pd/Ag based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of microsctructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300 C to 850 C. The samples were investigated by means of X-ray diffraction, SEM amd EDAX analysis techiques; the results of these analises as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of the resistivity and adhesion. The relevance and limitations of each analytical technique for the examination of thick-film conductors are emphasized.
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