In this work we show a method for the thermal dynamic modeling of packaged HBT's, The method employs a calibration step featuring pulsed measurements at different temperatures, and is based upon a 3-stage thermal resistance-capacitance model that describes the chip-solder-case system. A current pulse generator was designed and assembled in-house for pulsed characterization down to the microsecond range. The model was used to simulate the thermal transients of the collector current from the microsecond range to hundreds of seconds, for several different bias points in the forward active region, consistently showing a good match with the measured characteristics.

Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBT's / M., Busani; R., Menozzi; Borgarino, Mattia; Fantini, Fausto. - In: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. - ISSN 1521-3331. - STAMPA. - 23:2(2000), pp. 352-359. [10.1109/6144.846774]

Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBT's

BORGARINO, Mattia;FANTINI, Fausto
2000

Abstract

In this work we show a method for the thermal dynamic modeling of packaged HBT's, The method employs a calibration step featuring pulsed measurements at different temperatures, and is based upon a 3-stage thermal resistance-capacitance model that describes the chip-solder-case system. A current pulse generator was designed and assembled in-house for pulsed characterization down to the microsecond range. The model was used to simulate the thermal transients of the collector current from the microsecond range to hundreds of seconds, for several different bias points in the forward active region, consistently showing a good match with the measured characteristics.
2000
23
2
352
359
Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBT's / M., Busani; R., Menozzi; Borgarino, Mattia; Fantini, Fausto. - In: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES. - ISSN 1521-3331. - STAMPA. - 23:2(2000), pp. 352-359. [10.1109/6144.846774]
M., Busani; R., Menozzi; Borgarino, Mattia; Fantini, Fausto
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/612576
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