The paper deals with the design of a 5GHz WLAN heterodyne transmitter for domotic applications. The transmitter has been realized in commercial 0.35mum Si/SiGe BiCMOS technology with the purpose to reduce cost while achieve an high integration level. Measurements on a prototype, wire-bonded on a low-cost FR4 printed circuit board, have been carried-out showing an overall linear gain of 14dB an input referred compression point of -6.5dBm and a third-order input intercept point of +2.7dBm
A Single-Chip 5GHz WLAN Transmitter in 0.35um Si/SiGe BiCMOS Technology / F., Alimenti; Borgarino, Mattia; R., Codeluppi; V., Palazzari; M., Pifferi; L., Roselli; A., Scorzoni; Fantini, Fausto. - STAMPA. - 1:(2006), pp. 379-382. (Intervento presentato al convegno 1st European Microwave Integrated Circuits Conference, EuMIC 2006 tenutosi a Manchester (UK) nel 10-13 September 2006) [10.1109/EMICC.2006.282661].
A Single-Chip 5GHz WLAN Transmitter in 0.35um Si/SiGe BiCMOS Technology
BORGARINO, Mattia;FANTINI, Fausto
2006
Abstract
The paper deals with the design of a 5GHz WLAN heterodyne transmitter for domotic applications. The transmitter has been realized in commercial 0.35mum Si/SiGe BiCMOS technology with the purpose to reduce cost while achieve an high integration level. Measurements on a prototype, wire-bonded on a low-cost FR4 printed circuit board, have been carried-out showing an overall linear gain of 14dB an input referred compression point of -6.5dBm and a third-order input intercept point of +2.7dBm
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