The design of a novel test structure to study the influence of electromigration and thermomigration in the large dimension metal lines used in power integrated circuits is reported.
Design of a test structure to evaluate electro-thermomigration in power ICs / I., De Munari; F., Speroni; M., Reverberi; C., Neva; L., Lonzi; Fantini, Fausto. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - STAMPA. - 36:(1996), pp. 1875-1878. [10.1016/0026-2714(96)00219-1]
Design of a test structure to evaluate electro-thermomigration in power ICs
FANTINI, Fausto
1996
Abstract
The design of a novel test structure to study the influence of electromigration and thermomigration in the large dimension metal lines used in power integrated circuits is reported.
Pubblicazioni consigliate
I metadati presenti in IRIS UNIMORE sono rilasciati con licenza Creative Commons CC0 1.0 Universal, mentre i file delle pubblicazioni sono rilasciati con licenza Attribuzione 4.0 Internazionale (CC BY 4.0), salvo diversa indicazione.
In caso di violazione di copyright, contattare Supporto Iris
