In this paper, we investigate the impact of Buffer resistivity and AlGaN barrier design on back-bias stress performed on 100 V p-GaN gate AlGaN/GaN HEMTs. To this end, we compare the results obtained in terms of (i) vertical leakage, (ii) back-bias stress on Transmission Line Measurements (TLM) structures and (iii) back-gating on real transistors. Concerning the latter, a novel test sequence is implemented to monitor the drain current evolution during the stress and evaluate the impact on V TH and R ON parameters after 1000 s stress with V SUB =-50 V. Results indicate that high resistive buffer can significantly reduce the back-bias effect, but also the AlGaN barrier design can affect the parameters drift due to a different two-dimensional electron gas (2DEG) density.

Impact of Process Variations on Back-Bias Effect in 100V p-GaN Gate AlGaN/GaN HEMTs / Cioni, M.; Giorgino, G.; Chini, A.; Marletta, G.; Miccoli, C.; Castagna, M. E.; Luongo, G.; Moschetti, M.; Tringali, C.; Iucolano, F.. - (2023). (Intervento presentato al convegno 10th IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2023 tenutosi a usa nel 2023) [10.1109/WiPDA58524.2023.10382224].

Impact of Process Variations on Back-Bias Effect in 100V p-GaN Gate AlGaN/GaN HEMTs

Giorgino G.;Chini A.;
2023

Abstract

In this paper, we investigate the impact of Buffer resistivity and AlGaN barrier design on back-bias stress performed on 100 V p-GaN gate AlGaN/GaN HEMTs. To this end, we compare the results obtained in terms of (i) vertical leakage, (ii) back-bias stress on Transmission Line Measurements (TLM) structures and (iii) back-gating on real transistors. Concerning the latter, a novel test sequence is implemented to monitor the drain current evolution during the stress and evaluate the impact on V TH and R ON parameters after 1000 s stress with V SUB =-50 V. Results indicate that high resistive buffer can significantly reduce the back-bias effect, but also the AlGaN barrier design can affect the parameters drift due to a different two-dimensional electron gas (2DEG) density.
2023
10th IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2023
usa
2023
Cioni, M.; Giorgino, G.; Chini, A.; Marletta, G.; Miccoli, C.; Castagna, M. E.; Luongo, G.; Moschetti, M.; Tringali, C.; Iucolano, F.
Impact of Process Variations on Back-Bias Effect in 100V p-GaN Gate AlGaN/GaN HEMTs / Cioni, M.; Giorgino, G.; Chini, A.; Marletta, G.; Miccoli, C.; Castagna, M. E.; Luongo, G.; Moschetti, M.; Tringali, C.; Iucolano, F.. - (2023). (Intervento presentato al convegno 10th IEEE Workshop on Wide Bandgap Power Devices and Applications, WiPDA 2023 tenutosi a usa nel 2023) [10.1109/WiPDA58524.2023.10382224].
File in questo prodotto:
Non ci sono file associati a questo prodotto.
Pubblicazioni consigliate

Licenza Creative Commons
I metadati presenti in IRIS UNIMORE sono rilasciati con licenza Creative Commons CC0 1.0 Universal, mentre i file delle pubblicazioni sono rilasciati con licenza Attribuzione 4.0 Internazionale (CC BY 4.0), salvo diversa indicazione.
In caso di violazione di copyright, contattare Supporto Iris

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1332187
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 0
  • ???jsp.display-item.citation.isi??? ND
social impact