The impact of device-to-device statistical variation on Program/Erase (P/E) transients of planar TANOS devices is investigated using a multi-scale simulation approach. Atomic-level material and defect properties are first extracted from experimental results and then employed to study variability of the flat-band voltage shift. Erase characteristics are observed to be more affected by statistical variation. Interestingly, by adjusting temperature, gate voltage and/or blocking layer thickness, an optimized operating condition can be reached such that variability in 3D TANOS arrays is minimized.

Statistical Simulation to Predict Variability of TANOS Program/Erase Characteristics for Non-Volatile Memory Applications / Baten, M. Z.; Kumar, M. A.; Padovani, A.; Larcher, L.; Pramanik, D.. - (2019), pp. 203-205. (Intervento presentato al convegno 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 tenutosi a sgp nel 2019) [10.1109/EDTM.2019.8731308].

Statistical Simulation to Predict Variability of TANOS Program/Erase Characteristics for Non-Volatile Memory Applications

Padovani A.;Larcher L.;
2019

Abstract

The impact of device-to-device statistical variation on Program/Erase (P/E) transients of planar TANOS devices is investigated using a multi-scale simulation approach. Atomic-level material and defect properties are first extracted from experimental results and then employed to study variability of the flat-band voltage shift. Erase characteristics are observed to be more affected by statistical variation. Interestingly, by adjusting temperature, gate voltage and/or blocking layer thickness, an optimized operating condition can be reached such that variability in 3D TANOS arrays is minimized.
2019
2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
sgp
2019
203
205
Baten, M. Z.; Kumar, M. A.; Padovani, A.; Larcher, L.; Pramanik, D.
Statistical Simulation to Predict Variability of TANOS Program/Erase Characteristics for Non-Volatile Memory Applications / Baten, M. Z.; Kumar, M. A.; Padovani, A.; Larcher, L.; Pramanik, D.. - (2019), pp. 203-205. (Intervento presentato al convegno 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 tenutosi a sgp nel 2019) [10.1109/EDTM.2019.8731308].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1223046
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