This paper addresses selected topics about recent developments in CMOS technologies evolving towards 3D integrated circuits and incorporating innovative device concepts and ever new materials.

New device concepts, transistor architectures and materials for high performance and energy efficient CMOS circuits in the forthcoming era of 3D integrated circuits / Esseni, D.; Badami, O.; Driussi, F.; Lizzit, D.; Pala, M.; Palestri, P.; Rollo, T.; Selmi, L.; Venica, S.. - (2018), pp. 236-238. (Intervento presentato al convegno 2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 tenutosi a jpn nel 2018) [10.1109/EDTM.2018.8421501].

New device concepts, transistor architectures and materials for high performance and energy efficient CMOS circuits in the forthcoming era of 3D integrated circuits

P. Palestri;L. Selmi;
2018

Abstract

This paper addresses selected topics about recent developments in CMOS technologies evolving towards 3D integrated circuits and incorporating innovative device concepts and ever new materials.
2018
2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018
jpn
2018
236
238
Esseni, D.; Badami, O.; Driussi, F.; Lizzit, D.; Pala, M.; Palestri, P.; Rollo, T.; Selmi, L.; Venica, S.
New device concepts, transistor architectures and materials for high performance and energy efficient CMOS circuits in the forthcoming era of 3D integrated circuits / Esseni, D.; Badami, O.; Driussi, F.; Lizzit, D.; Pala, M.; Palestri, P.; Rollo, T.; Selmi, L.; Venica, S.. - (2018), pp. 236-238. (Intervento presentato al convegno 2nd IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018 tenutosi a jpn nel 2018) [10.1109/EDTM.2018.8421501].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1166947
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