A 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.

Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall / Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca. - ELETTRONICO. - (2015), pp. 34-38. (Intervento presentato al convegno 2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) tenutosi a Torino, Italia nel 16-18 settembre 2015) [10.1109/RTSI.2015.7325068].

Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall

PALESTRI, Pierpaolo;SELMI, Luca
2015

Abstract

A 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.
2015
2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI)
Torino, Italia
16-18 settembre 2015
34
38
Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca
Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall / Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca. - ELETTRONICO. - (2015), pp. 34-38. (Intervento presentato al convegno 2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) tenutosi a Torino, Italia nel 16-18 settembre 2015) [10.1109/RTSI.2015.7325068].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1163064
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