EnglishA 2.5 Gb/s high-speed serial transmitter for automotive applications has been designed and a circuit/package/board integrated simulation procedure has been set up, enabling the co-design of High-Speed-Serial Interfaces. This simulation methodology employs transistor level models of the transmitter combined with physical-based models of the transmission channel, thus no simplified behavioral models are needed. Model/hardware correlation is reported, including eye closure and jitter effects. Good mutual agreement is found between experiments and simulations.
Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall / Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca. - ELETTRONICO. - (2015), pp. 34-38. ((Intervento presentato al convegno 2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) tenutosi a Torino, Italia nel 16-18 settembre 2015.
| Data di pubblicazione: | 2015 |
| Titolo: | Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall |
| Autore/i: | Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca |
| Autore/i UNIMORE: | |
| Digital Object Identifier (DOI): | http://dx.doi.org/10.1109/RTSI.2015.7325068 |
| Nome del convegno: | 2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) |
| Luogo del convegno: | Torino, Italia |
| Data del convegno: | 16-18 settembre 2015 |
| Pagina iniziale: | 34 |
| Pagina finale: | 38 |
| Citazione: | Design, characterization and signal integrity analysis of a 2.5 Gb/s high-speed serial interface for automotive applications overarching the chip/PCB wall / Cossettini, Andrea; Cristofoli, A.; Grollitsch, W.; Alves, L.; Nonis, R.; Ricca, L. Della; Palestri, Pierpaolo; Selmi, Luca. - ELETTRONICO. - (2015), pp. 34-38. ((Intervento presentato al convegno 2015 IEEE 1st International Forum on Research and Technologies for Society and Industry Leveraging a better tomorrow (RTSI) tenutosi a Torino, Italia nel 16-18 settembre 2015. |
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http://hdl.handle.net/11380/1163064
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