The SEM-EDAX anslysis of the interaction of shypley's positive photoresist AZ-1350J with thick-film pastes DP9596 and DP1441 is reported. The interaction is found to make the resistor surface smoother and conductor surface denser than those of processed conventionally. The golf from DP 9596 (pt-Au) paste is also observed to pass through the photoresist during firing and settle underneath on alumina substrate in tje form of 0.5 mircometers sizd grains. The interaction is found useful for fabricating microlines and cantilevered structures for sensor developmet.
SEM-EDAX analysis of interaction of photoresist with thick-films / A., Singh; M., Prudenziati; Morten, Bruno. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - STAMPA. - 25:(1985), pp. 243-255.
SEM-EDAX analysis of interaction of photoresist with thick-films
MORTEN, Bruno
1985
Abstract
The SEM-EDAX anslysis of the interaction of shypley's positive photoresist AZ-1350J with thick-film pastes DP9596 and DP1441 is reported. The interaction is found to make the resistor surface smoother and conductor surface denser than those of processed conventionally. The golf from DP 9596 (pt-Au) paste is also observed to pass through the photoresist during firing and settle underneath on alumina substrate in tje form of 0.5 mircometers sizd grains. The interaction is found useful for fabricating microlines and cantilevered structures for sensor developmet.
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