The paper deals with reverse photolitographic technique, applied for the first time for the processing of thick-film components on alumina substrates. The SEm phographs of the delineated patterns have revealed excellent edge line definition which is always saw-tooth shaped in the conventional process. various VLSI applicationpotentials have also been pointed out.
Reverse photolitographic technique for thicl-film circuits / A., Singh; M., Prudenziati; Morten, Bruno. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - STAMPA. - 25:(1985), pp. 61-83.
Reverse photolitographic technique for thicl-film circuits
MORTEN, Bruno
1985
Abstract
The paper deals with reverse photolitographic technique, applied for the first time for the processing of thick-film components on alumina substrates. The SEm phographs of the delineated patterns have revealed excellent edge line definition which is always saw-tooth shaped in the conventional process. various VLSI applicationpotentials have also been pointed out.
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