An outline of versatile device structures and test methodologies is provided to streamline the fabrication and characterization of β-Ga2O3 and other novel semiconductor materials for the purpose of investigating gate oxide and metal contact interfaces. β-Ga2O3/Al2O3 metal-oxide-semiconductor capacitors (MOSCAPs) and β-Ga2O3/Ti/Au transfer length method (TLM) structures are fabricated for preliminary investigation of dielectric trapping and contact properties as a function of processing. Multifrequency C-V measurements of MOSCAPs show negligible differences in charge trapping at or near the oxide interface following ultraviolet-ozone (UV-O3) surface pretreatment. Additionally, I-V TLM characterization demonstrates improvements in ohmic contact properties after an O2 plasma surface cleaning prior to metallization.
Methodology and Test Structures for Studying β-Ga2O3 Dielectric and Contact Interfaces / Gruszecki, A. A.; Roy, J.; Agrawal, K. S.; La Torraca, P.; Cherkaoui, K.; Hurley, P. K.; Wallace, R. M.; Young, C. D.. - (2025), pp. 1-6. ( 37th IEEE International Conference on Microelectronic Test Structures, ICMTS 2025 San Antonio, TX, USA 2024) [10.1109/icmts63811.2025.11068900].
Methodology and Test Structures for Studying β-Ga2O3 Dielectric and Contact Interfaces
La Torraca, P.;
2025
Abstract
An outline of versatile device structures and test methodologies is provided to streamline the fabrication and characterization of β-Ga2O3 and other novel semiconductor materials for the purpose of investigating gate oxide and metal contact interfaces. β-Ga2O3/Al2O3 metal-oxide-semiconductor capacitors (MOSCAPs) and β-Ga2O3/Ti/Au transfer length method (TLM) structures are fabricated for preliminary investigation of dielectric trapping and contact properties as a function of processing. Multifrequency C-V measurements of MOSCAPs show negligible differences in charge trapping at or near the oxide interface following ultraviolet-ozone (UV-O3) surface pretreatment. Additionally, I-V TLM characterization demonstrates improvements in ohmic contact properties after an O2 plasma surface cleaning prior to metallization.| File | Dimensione | Formato | |
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