Aluminum Oxide as a Dielectric and Passivation Layer for (flexible) Metal-Oxide and 2D Semiconductor Devices

We discuss the role of aluminum oxide (i.e. Al2O3 when stoichiometric) for transistors and sensors based on oxide semiconductors such as InGaZnO (IGZO) and two-dimensional (2D) semiconductors, such as monolayer MoS2. Aluminum oxide is a well-known capping and dielectric layer in semiconductor technology typically deposited by atomic-layer deposition (ALD), which offers a dense and high-quality film with low gas permeability even when deposited on flexible substrates. However, when deposited at low temperature (< 200C), aluminum oxide can include a significant amount of fixed charges and defects, which lead to unusual charge trapping and doping effects in semiconductor devices. For example, such charge trapping can cause (apparent) sub-60 mV/decade subthreshold swing at room temperature in IGZO transistors, but can also lead to potential applications in neuromorphic computing. We also discuss effective doping (-1013 cm-2) of 2D semiconductors by thin ALD-grown non-stoichiometric AlOx capping layers. This is achieved with an aluminum seed layer, which enables uniform growth of the subsequently deposited ALD film. This approach leads to a negative shift in threshold voltage, record on-state current (-700 μA/μm) in a monolayer semiconductor, and drastic reduction in contact resistance. Finally, we investigate the passivation effects of Al2O3 capping, which limits the interaction of the underlying semiconductors with ambient air and moisture. We demonstrate improved response in MoS2temperature sensors and long-term stability in flexible MoS2transistors (8 months). Further, we evaluate the effects of Al2O3 passivation on IGZO transistors after aging for 80 months.