In this work, we analyze the effect of CF4/O-2 plasma treatment on the contact interface between the amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) semiconductor and Titanium-Gold electrodes. First, the influence of CF4/O-2 plasma treatment is evaluated using transmission line structures and compared to pure O-2 and CF4 plasma, resulting in a reduction of the contact resistance RC by a factor of 24.2 compared to untreated interfaces. Subsequently, the CF4/O-2 plasma treatment is integrated in the a-IGZO thin-film transistor (TFT) fabrication process flow. We achieve a reduction of the gate bias dependent RC by a factor up to 13.4, which results in an increased current drive capability. Combined with an associated channel length reduction, the effective linear field-effect mobility mu(lin,FE,eff) is increased by up to 74.6% for the CF4/O-2 plasma treated TFTs compared to untreated reference devices.

Improvement of contact resistance in flexible a-IGZO thin-film transistors by CF4/O-2 plasma treatment / Knobelspies, S; Takabayashi, A; Daus, A; Cantarella, G; Münzenrieder, N; Troster, G. - In: SOLID-STATE ELECTRONICS. - ISSN 0038-1101. - 150:(2018), pp. 23-27. [10.1016/j.sse.2018.10.002]

Improvement of contact resistance in flexible a-IGZO thin-film transistors by CF4/O-2 plasma treatment

Cantarella G;
2018

Abstract

In this work, we analyze the effect of CF4/O-2 plasma treatment on the contact interface between the amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) semiconductor and Titanium-Gold electrodes. First, the influence of CF4/O-2 plasma treatment is evaluated using transmission line structures and compared to pure O-2 and CF4 plasma, resulting in a reduction of the contact resistance RC by a factor of 24.2 compared to untreated interfaces. Subsequently, the CF4/O-2 plasma treatment is integrated in the a-IGZO thin-film transistor (TFT) fabrication process flow. We achieve a reduction of the gate bias dependent RC by a factor up to 13.4, which results in an increased current drive capability. Combined with an associated channel length reduction, the effective linear field-effect mobility mu(lin,FE,eff) is increased by up to 74.6% for the CF4/O-2 plasma treated TFTs compared to untreated reference devices.
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Improvement of contact resistance in flexible a-IGZO thin-film transistors by CF4/O-2 plasma treatment / Knobelspies, S; Takabayashi, A; Daus, A; Cantarella, G; Münzenrieder, N; Troster, G. - In: SOLID-STATE ELECTRONICS. - ISSN 0038-1101. - 150:(2018), pp. 23-27. [10.1016/j.sse.2018.10.002]
Knobelspies, S; Takabayashi, A; Daus, A; Cantarella, G; Münzenrieder, N; Troster, G
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1290926
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