We investigate the mechanism governing threshold voltage (VTH) hysteresis in packaged SiC MOSFETs. A double-ramp measurement method was employed for this scope, being able to accurately evaluate the time-dependent recovery of the positive VTH shift induced by the sweep-up of the gate voltage. Particularly, we studied the effect of the (i) gate driving voltage (VGH), (ii) recovery time (TOFF) and (iii) temperature (T) on the VTH hysteresis. No appreciable differences were observed among data collected at different VGH, whereas a recovery speed-up was observed at higher T values. Temperature dependent measurement of VTH recovery yielded a 0.3 eV activation energy, that has been associated to SiC/SiO2 interface traps located ~0.3 eV below the SiC conduction band.

Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs / Cioni, M.; Fiorenza, P.; Roccaforte, F.; Saggio, M.; Cascino, S.; Messina, A.; Vinciguerra, V.; Calabretta, M.; Chini, A.. - 2022-:(2022), pp. B31-5B35. ((Intervento presentato al convegno 2022 IEEE International Reliability Physics Symposium, IRPS 2022 tenutosi a usa nel 2022 [10.1109/IRPS48227.2022.9764543].

Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs

Cioni M.;Chini A.
2022

Abstract

We investigate the mechanism governing threshold voltage (VTH) hysteresis in packaged SiC MOSFETs. A double-ramp measurement method was employed for this scope, being able to accurately evaluate the time-dependent recovery of the positive VTH shift induced by the sweep-up of the gate voltage. Particularly, we studied the effect of the (i) gate driving voltage (VGH), (ii) recovery time (TOFF) and (iii) temperature (T) on the VTH hysteresis. No appreciable differences were observed among data collected at different VGH, whereas a recovery speed-up was observed at higher T values. Temperature dependent measurement of VTH recovery yielded a 0.3 eV activation energy, that has been associated to SiC/SiO2 interface traps located ~0.3 eV below the SiC conduction band.
2022 IEEE International Reliability Physics Symposium, IRPS 2022
usa
2022
2022-
B31
5B35
Cioni, M.; Fiorenza, P.; Roccaforte, F.; Saggio, M.; Cascino, S.; Messina, A.; Vinciguerra, V.; Calabretta, M.; Chini, A.
Identification of Interface States responsible for VTHHysteresis in packaged SiC MOSFETs / Cioni, M.; Fiorenza, P.; Roccaforte, F.; Saggio, M.; Cascino, S.; Messina, A.; Vinciguerra, V.; Calabretta, M.; Chini, A.. - 2022-:(2022), pp. B31-5B35. ((Intervento presentato al convegno 2022 IEEE International Reliability Physics Symposium, IRPS 2022 tenutosi a usa nel 2022 [10.1109/IRPS48227.2022.9764543].
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11380/1286881
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