A simple test method for measurement of the interface thermal resistance of coated and uncoated metal surfaces

Dies for metal casting must often be coated internally to minimize interaction between the surface of the steel die and the melt metal during pouring and solidification. However, the added coating increases the thermal interface resistance during the cooling process and can thus extend the process duration. For example, numerical predictions and experimental results are matched if the interface resistance is even quintupled in the presence of usual interface coating, compared to the uncoated mold. In order to have a reasonable estimate of the interface thermal resistance, an easy to use measurement approach has been tested. This consists of contacting a cold and a hot samples of metals with known thermal properties, one at ambient temperature and the other one much hotter. The temperatures of the two samples, assumed to be uniform in each sample, are measured by thermocouples, and the interface resistance is retrieved from the time evolution pattern of those temperatures during the thermal transient that follows the instant in which the samples have been contacted.

Molds for metal casting are often internally coated in order to minimize the interaction between the steel surface of the mold and the melted metal during its pouring and solidification. However, the added coating increases the thermal interface resistance during the cooling process and it can thus affect the process itself. For example, numerical predictions and experimental results are matched only if the interface resistance is even quintupled in the presence of the usual interface coating, compared to the uncoated mold. In order to have a reasonable estimate of the interface thermal resistance, an easy to use measurement approach has been tested. This consists of contacting a cold and a hot samples of metals with known thermal properties, one at ambient temperature and the other one much hotter. The temperatures of the two samples, assumed to be uniform in each sample, are measured by thermocouples placed inside the samples through a hole, and the interface resistance is calculated from the time evolution pattern of those temperatures during the thermal transient that follows the instant in which the samples have been contacted.