Advancements in power electronic technologies require devices which are small, reliable and capable of handling large power levels. Despite efficiencies of electronic components are usually above 90%, wasted thermal powers can result in heat flux densities in the order of hundreds of W/cm2. To avoid degradation in performance and lifetime of these electronic devices, specific active cooling systems need to be adopted and submerged impinging jets represent one of the most promising solutions. In the present paper a numerical study of different cooling jet configurations is presented, and high-efficiency solutions are sought. The configurations investigated are obtained by varying nozzle diameter, aspect ratio, arrangement and number of jets. Simulations are performed on a simplified computational domain which involves a single rectangular chip (representing the heat source) separated from the coolant by a multi-material solid stack. As compared to more classical solutions like pin fins, submerged impinging jets represent an efficient technique for the cooling of power electronics. Heat is exchanged at low pumping power level. Array of jets are flexible in terms of geometry and can be specifically designed to control temperatures in critical spots.

Numerical study of submerged impinging jets for power electronics cooling / Sabato, Massimo; Fregni, Andrea; Stalio, Enrico; Brusiani, Federico; Tranchero, Maurizio; Baritaud, Thierry. - In: INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. - ISSN 0017-9310. - 141:(2019), pp. 707-718. [10.1016/j.ijheatmasstransfer.2019.06.081]

Numerical study of submerged impinging jets for power electronics cooling

Massimo Sabato;Andrea Fregni;Enrico Stalio;
2019

Abstract

Advancements in power electronic technologies require devices which are small, reliable and capable of handling large power levels. Despite efficiencies of electronic components are usually above 90%, wasted thermal powers can result in heat flux densities in the order of hundreds of W/cm2. To avoid degradation in performance and lifetime of these electronic devices, specific active cooling systems need to be adopted and submerged impinging jets represent one of the most promising solutions. In the present paper a numerical study of different cooling jet configurations is presented, and high-efficiency solutions are sought. The configurations investigated are obtained by varying nozzle diameter, aspect ratio, arrangement and number of jets. Simulations are performed on a simplified computational domain which involves a single rectangular chip (representing the heat source) separated from the coolant by a multi-material solid stack. As compared to more classical solutions like pin fins, submerged impinging jets represent an efficient technique for the cooling of power electronics. Heat is exchanged at low pumping power level. Array of jets are flexible in terms of geometry and can be specifically designed to control temperatures in critical spots.
2019
2019
141
707
718
Numerical study of submerged impinging jets for power electronics cooling / Sabato, Massimo; Fregni, Andrea; Stalio, Enrico; Brusiani, Federico; Tranchero, Maurizio; Baritaud, Thierry. - In: INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER. - ISSN 0017-9310. - 141:(2019), pp. 707-718. [10.1016/j.ijheatmasstransfer.2019.06.081]
Sabato, Massimo; Fregni, Andrea; Stalio, Enrico; Brusiani, Federico; Tranchero, Maurizio; Baritaud, Thierry
File in questo prodotto:
File Dimensione Formato  
paper_impinging_jets_rev003_no_marks.pdf

Open access

Tipologia: Versione originale dell'autore proposta per la pubblicazione
Dimensione 10.86 MB
Formato Adobe PDF
10.86 MB Adobe PDF Visualizza/Apri
1-s2.0-S0017931019305642-main.pdf

Accesso riservato

Tipologia: Versione pubblicata dall'editore
Dimensione 2.16 MB
Formato Adobe PDF
2.16 MB Adobe PDF   Visualizza/Apri   Richiedi una copia
Pubblicazioni consigliate

Licenza Creative Commons
I metadati presenti in IRIS UNIMORE sono rilasciati con licenza Creative Commons CC0 1.0 Universal, mentre i file delle pubblicazioni sono rilasciati con licenza Attribuzione 4.0 Internazionale (CC BY 4.0), salvo diversa indicazione.
In caso di violazione di copyright, contattare Supporto Iris

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1182306
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 30
  • ???jsp.display-item.citation.isi??? 26
social impact