The evaluation and investigation of electrical parameters drifts during device operation is one of the mandatory task that has to be performed in order to improve GaN-power devices stability. In this work the authors would like to present a novel characterization method that allows the simultaneous monitoring of both RONand VTHduring the switch-mode operation. By applying the proposed measurement method with different operating parameters it has been possible to provide a preliminary interpretation of the physical mechanisms leading to the observed RONincrease and VTHpositive shift. In particular, the observed RONincrease, which is thermally activated with a 0.83eV activation energy, has been ascribed to the presence of Carbon-related traps within the device buffer layer. On the other hand, the positive VTHshift has instead been related to interface defects at the dielectric/III-N interface and/or to bulk traps in the gate dielectric.
Evolution of on-resistance (RON) and threshold voltage (VTH) in GaN HEMTs during switch-mode operation / Chini, Alessandro; Iucolano, Ferdinando. - In: MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. - ISSN 1369-8001. - 78:(2018), pp. 127-131. [10.1016/j.mssp.2017.10.029]
Evolution of on-resistance (RON) and threshold voltage (VTH) in GaN HEMTs during switch-mode operation
Chini, Alessandro
;
2018
Abstract
The evaluation and investigation of electrical parameters drifts during device operation is one of the mandatory task that has to be performed in order to improve GaN-power devices stability. In this work the authors would like to present a novel characterization method that allows the simultaneous monitoring of both RONand VTHduring the switch-mode operation. By applying the proposed measurement method with different operating parameters it has been possible to provide a preliminary interpretation of the physical mechanisms leading to the observed RONincrease and VTHpositive shift. In particular, the observed RONincrease, which is thermally activated with a 0.83eV activation energy, has been ascribed to the presence of Carbon-related traps within the device buffer layer. On the other hand, the positive VTHshift has instead been related to interface defects at the dielectric/III-N interface and/or to bulk traps in the gate dielectric.File | Dimensione | Formato | |
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