Resistance degradation of metallic strips due to electromigation is studied within a percolative approach based on a random resistor network. Both defect generation and recovery driven by a current stress are considered. The main features of experiments performed on Al-0.5%Cu lines are well reproduced, thus providing a unified description of degradation processes in terms of physical parameters. (C) 2001 Elsevier Science B.V. All rights reserved.

A percolative simulation of electromigration phenomena / Pennetta, C; Reggiani, L; Trefan, G; Fantini, Fausto; Demunari, I; Scorzoni, A.. - In: MICROELECTRONIC ENGINEERING. - ISSN 0167-9317. - STAMPA. - 55:1-4(2001), pp. 349-353. [10.1016/S0167-9317(00)00467-6]

A percolative simulation of electromigration phenomena

FANTINI, Fausto;
2001

Abstract

Resistance degradation of metallic strips due to electromigation is studied within a percolative approach based on a random resistor network. Both defect generation and recovery driven by a current stress are considered. The main features of experiments performed on Al-0.5%Cu lines are well reproduced, thus providing a unified description of degradation processes in terms of physical parameters. (C) 2001 Elsevier Science B.V. All rights reserved.
2001
55
1-4
349
353
A percolative simulation of electromigration phenomena / Pennetta, C; Reggiani, L; Trefan, G; Fantini, Fausto; Demunari, I; Scorzoni, A.. - In: MICROELECTRONIC ENGINEERING. - ISSN 0167-9317. - STAMPA. - 55:1-4(2001), pp. 349-353. [10.1016/S0167-9317(00)00467-6]
Pennetta, C; Reggiani, L; Trefan, G; Fantini, Fausto; Demunari, I; Scorzoni, A.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/6675
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