Pastes prepared with seven lead-free glass particles were screen-printed and fired on 96%-Al2O3 substrates. The fired films were studied in terms of sintering, devitrification, crack propagation and bleeding. The most promising glass compositions were selected for the preparation of RuO2-based tghick-film resistors (TFRs), on pre-fired PtAu - or PdAg based terminations; electrical properties of resistors (Rsvs:RuO2 volume fraction, temperature coefficient of resistanceand size effects) were investigated. The study eviced a myriad of complex phenomena occuring in the films, and emphasized the criticality in the choice of glass composition.

Lead free glasses for new generation of thick-film resistors: an explorative investigation / Prudenziati, Maria; Zanardi, F.; Morten, Bruno; Gualtieri, A. F.. - STAMPA. - 146:(2000), pp. 8-13. (Intervento presentato al convegno International Symposium on Microelectronics and Packaging, tenutosi a Israel K2 nel 15 june 2000).

Lead free glasses for new generation of thick-film resistors: an explorative investigation

PRUDENZIATI, Maria;MORTEN, Bruno;A. F. GUALTIERI
2000

Abstract

Pastes prepared with seven lead-free glass particles were screen-printed and fired on 96%-Al2O3 substrates. The fired films were studied in terms of sintering, devitrification, crack propagation and bleeding. The most promising glass compositions were selected for the preparation of RuO2-based tghick-film resistors (TFRs), on pre-fired PtAu - or PdAg based terminations; electrical properties of resistors (Rsvs:RuO2 volume fraction, temperature coefficient of resistanceand size effects) were investigated. The study eviced a myriad of complex phenomena occuring in the films, and emphasized the criticality in the choice of glass composition.
2000
International Symposium on Microelectronics and Packaging,
Israel K2
15 june 2000
Prudenziati, Maria; Zanardi, F.; Morten, Bruno; Gualtieri, A. F.
Lead free glasses for new generation of thick-film resistors: an explorative investigation / Prudenziati, Maria; Zanardi, F.; Morten, Bruno; Gualtieri, A. F.. - STAMPA. - 146:(2000), pp. 8-13. (Intervento presentato al convegno International Symposium on Microelectronics and Packaging, tenutosi a Israel K2 nel 15 june 2000).
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/605931
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