In the framework of the development of a submicron CMOS technology, we investigate the reliability of Al stripes 1.5-8 micron wide and compared the results obtained with various techniques; in particular in this paper the resistometric method is compared with the standard MYF technique for the narrowest stripes.

On the validity of resistometric technique in electromigration studies of narrow stripes / Fantini, Fausto; G., Specchiulli; C., Caprile. - In: THIN SOLID FILMS. - ISSN 0040-6090. - STAMPA. - 72:(1989), pp. L85-L89. [10.1016/0040-6090(89)90658-5]

On the validity of resistometric technique in electromigration studies of narrow stripes

FANTINI, Fausto;
1989

Abstract

In the framework of the development of a submicron CMOS technology, we investigate the reliability of Al stripes 1.5-8 micron wide and compared the results obtained with various techniques; in particular in this paper the resistometric method is compared with the standard MYF technique for the narrowest stripes.
1989
Inglese
72
L85
L89
Electromigration. Resistometric techniques. Sputtered Al-1% Si.
none
info:eu-repo/semantics/article
Contributo su RIVISTA::Articolo su rivista
262
On the validity of resistometric technique in electromigration studies of narrow stripes / Fantini, Fausto; G., Specchiulli; C., Caprile. - In: THIN SOLID FILMS. - ISSN 0040-6090. - STAMPA. - 72:(1989), pp. L85-L89. [10.1016/0040-6090(89)90658-5]
Fantini, Fausto; G., Specchiulli; C., Caprile
3
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/451795
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