This paper describes an implementation of a model-based methodology to validate an innovative Hardware-in-the-loop (HIL) scheme applied to a mechatronic modular structure for a packaging machine. This new HIL environment is implemented by means of a unique CPU and allows use of an ordinary personal computer for the HIL simulation of a module of the packaging machine, without any other hardware tool. The research includes identification of modular building blocks through a suitable model-based systems design, with SysML models, Simulink models, and Beckhoff TwinCAT software. The novel HIL scheme is presented accompanied by experimental results of a composite module, which consists of four sub-modules.

Design of a packaging machine and virtual commissioning via modular hardware-in-the-loop simulations / Tessari, R.; Fantuzzi, C.. - (2016), pp. 1-5. (Intervento presentato al convegno 18th Mediterranean Electrotechnical Conference, MELECON 2016 tenutosi a cyp nel 2016) [10.1109/MELCON.2016.7495407].

Design of a packaging machine and virtual commissioning via modular hardware-in-the-loop simulations

Fantuzzi C.
2016

Abstract

This paper describes an implementation of a model-based methodology to validate an innovative Hardware-in-the-loop (HIL) scheme applied to a mechatronic modular structure for a packaging machine. This new HIL environment is implemented by means of a unique CPU and allows use of an ordinary personal computer for the HIL simulation of a module of the packaging machine, without any other hardware tool. The research includes identification of modular building blocks through a suitable model-based systems design, with SysML models, Simulink models, and Beckhoff TwinCAT software. The novel HIL scheme is presented accompanied by experimental results of a composite module, which consists of four sub-modules.
2016
18th Mediterranean Electrotechnical Conference, MELECON 2016
cyp
2016
1
5
Tessari, R.; Fantuzzi, C.
Design of a packaging machine and virtual commissioning via modular hardware-in-the-loop simulations / Tessari, R.; Fantuzzi, C.. - (2016), pp. 1-5. (Intervento presentato al convegno 18th Mediterranean Electrotechnical Conference, MELECON 2016 tenutosi a cyp nel 2016) [10.1109/MELCON.2016.7495407].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11380/1222834
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